Journal:
1. Huan-Yu Shih, Makoto Shiojiri, Ching-Hsiang Chen, Sheng-Fu Yu, Chung-Ting Ko, Jer-Ren Yang, Ray-Ming Lin*, and Miin-Jang Chen*, “Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs,” Scientific Reports, 5, 13671, 2015.
2. Wei-Cheng Wang, Meng-Chen Tsai, Jason Yang, Chuck Hsu, and Miin-Jang Chen*, “Efficiency enhancement of nanotextured black silicon solar cells using Al2O3/TiO2 dual-layer passivation stack prepared by atomic layer deposition,” ACS Applied Materials and Interfaces, 7, 10228–10237, 2015.
3. Chung-Ting Ko, Po-Shuan Yang, Yin-Yi Han, Wei-Cheng Wang, Jhih-Jie Huang, Yen-Hui Lee, Yi-Jen Tsai, Jay Shieh, and Miin-Jang Chen*, “Atomic-layer-deposited silver and dielectric nanostructures for plasmonic enhancement of Raman scattering from nanoscale ultrathin films”,Nanotechnology 26, 265702 (9pp), 2015.
4. Shih-Yung Chen, Wei-Liang Chen, Chung-Ting Ko, Ming-Yu Lai, Feng-Chieh Li, Yu-Yang Lee, Kun-Tong Tsai, Miin-Jang Chen*, Yu-Ming Chang*, and Yuh-Lin Wang*, “Photoluminescence from quasi-dendritic ZnO nanostructures grown in anodic alumina nanochannels," Mater. Res. Express 2, 115004, 2015.
5. Jhih-Jie Huang, Yi-Jen Tsai, Meng-Chen Tsai, Li-Tien Huang, Min-Hung Lee, Miin-Jang Chen*, “Impact of nitrogen depth profiles on the electrical properties of crystalline high-K gate dielectrics,” Applied Surface Science, 324, 662–668, 2015.
6. M.L. Chang, L.C. Wang, H.C. Lin, M.J. Chen*, and K.M. Lin*, “Investigation of defects in ultra-thin Al2O3 films deposited on pure copper by the atomic layer deposition technique,” Applied Surface Science, 359, 533–542, 2015
7. Huan-Yu Shih, Ming-Chih Lin, Liang-Yih Chen, and Miin-Jang Chen*, “Uniform GaN thin films grown on (100) silicon by remote plasma atomic layer deposition,” Nanotechnology, 26, 014002, 2015. (7 pages)
8. Jhih-Jie Huang, Yi-Jen Tsai, Meng-Chen Tsai, Min-Hung Lee, Miin-Jang Chen*, “Double nitridation of crystalline ZrO2/Al2O3 buffer gate stack with high capacitance, low leakage and improved thermal stability,” Applied Surface Science, 330, 221–227, 2015.